| Electronic Components Datasheet Search |
|
6ED003L02-F2 Datasheet(PDF) 19 Page - Infineon Technologies AG |
|
|
|||||||||||||||||||||||||||||
6ED003L02-F2 Datasheet(HTML) 19 Page - Infineon Technologies AG |
|
19 / 20 page ![]() EiceDRIVER™ 6ED003L06-F2, 6ED003L02-F2 datasheet 19 <Revision 2.8>, 05.08.2016 6.2 PG-TSSOP-28 Footprint for Reflow soldering e = 0.65 A = 6.10 L = 1.30 B = 0.40 Figure 17 Package drawing Figure 18 PCB reference layout (according to JEDEC 1s0P) left: Reference layout right: detail of footprint Table 8 Data of reference layout Dimensions Material Metal (Copper) 76.2 114.3 1.5 mm³ FR4 ( therm = 0.3 W/mK) 70µm ( therm = 388 W/mK) |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |