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STM32F318C8 Datasheet(PDF) 111 Page - STMicroelectronics |
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STM32F318C8 Datasheet(HTML) 111 Page - STMicroelectronics |
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111 / 125 page ![]() DocID026294 Rev 5 111/125 STM32F318C8 STM32F318K8 Package information 121 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 35. WLCSP49 marking example (package top view) 1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering Samples to run qualification activity. Table 71. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. |
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