©2014 Silicon Storage Technology, Inc.

DS20005020B

07/14

2

32 Mbit Multi-Purpose Flash Plus

SST39VF3201C / SST39VF3202C

Data Sheet

Product Description

The SST39VF3201C and SST39VF3202C devices are 2M x16 CMOS Multi-Purpose Flash Plus

(MPF+) manufactured with proprietary, high-performance CMOS SuperFlash technology. The split-

gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability com-

pared with alternate approaches. The SST39VF3201C/3202C write (Program or Erase) with a 2.7-

3.6V power supply. These devices conform to JEDEC standard pin assignments for x16 memories.

Featuring high performance Word-Program, the SST39VF3201C/3202C devices provide a typical

Word-Program time of 7 µsec. These devices use Toggle Bit, Data# Polling, or RY/BY# pin to indicate

the completion of Program operation. To protect against inadvertent write, they have on-chip hardware

and Software Data Protection schemes. Designed, manufactured, and tested for a wide spectrum of

applications, these devices are offered with a guaranteed typical endurance of 100,000 cycles. Data

retention is rated at greater than 100 years.

The SST39VF3201C/3202C devices are suited for applications that require convenient and economical

updating of program, configuration, or data memory. For all system applications, they significantly

improve performance and reliability, while lowering power consumption. They inherently use less

energy during Erase and Program than alternative flash technologies. The total energy consumed is a

function of the applied voltage, current, and time of application. Since for any given voltage range, the

SuperFlash technology uses less current to program and has a shorter erase time, the total energy

consumed during any Erase or Program operation is less than alternative flash technologies. These

devices also improve flexibility while lowering the cost for program, data, and configuration storage

applications.

The SuperFlash technology provides fixed Erase and Program times, independent of the number of

Erase/Program cycles that have occurred. Therefore the system software or hardware does not have

to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Pro-

gram times increase with accumulated Erase/Program cycles.

To meet high-density, surface mount requirements, the SST39VF3201C/3202C devices are offered in

48-lead TSOP and 48-ball TFBGA packages. See Figure 2 and Figure 3 for pin assignments.