USB82640 datasheet(53/64 Pages) MICROCHIP

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 2010-2015 Microchip Technology Inc.

DS60001312A-page 53

USB82640

FIGURE 10-2:

USB82640AM/AMR 48-PIN VQFN CONTINUED

Note:

Exposed Pad Variation H is valid for the USB82640.

Microchip Technology Drawing C04-223C Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

48-Lead Plastic Quad Flat, No Lead Package (RS) - 7x7 mm Body [VQFN]

With Exposed Pad; Punch Singulated

Number of Terminals

Overall Height

Terminal Width

Overall Width

Overall Length

Terminal Length

Exposed Pad Width

Exposed Pad Length

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

(A3)

0.50 BSC

0.20 REF

0.30

0.18

0.80

0.00

0.23

0.40

(See Exposed Pad Variations)

0.85

0.01

7.00 BSC

MILLIMETERS

MIN

NOM

0.50

0.30

0.90

0.05

MAX

0°

12°

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is punch singulated

Dimensioning and tolerancing per ASME Y14.5M

Mold Draft Angle

0.60

0.65

0.70

6.75 BSC

Mold Cap Height

Molded Top Width

Molded Top Length

Terminal-to-Exposed-Pad

0.20

(See Exposed Pad Variations)

7.00 BSC

6.75 BSC

Corner Chamfer

0.24

0.42

0.60

5.40 5.50 5.60

5.20 5.30 5.40

5.00 5.10 5.20

4.00 4.10 4.20

5.40 5.50 5.60

5.20 5.30 5.40

5.00 5.10 5.20

4.00 4.10 4.20

Symbol

Exposed Pad Variations

MIN NOM MAX MIN NOM MAX

Variant

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