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FT313HQ-R Datasheet(PDF) 57 Page - Future Technology Devices International Ltd. |
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FT313HQ-R Datasheet(HTML) 57 Page - Future Technology Devices International Ltd. |
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57 / 67 page ![]() Copyright © 2013 Future Technology Devices International Limited 57 Document No.: FT_000589 FT313H USB2.0 HS Host Controller Datasheet Version 1.2 Clearance No.: FTDI# 318 8 Package Parameters The FT313H is available in three different packages. The FT313HQ is the QFN-64 package, the FT313HL is the LQFP-64 package and the FT313HP is the TQFP-64 package. The solder reflow profile for all packages is described in following sections. 8.1 FT313H Package Markings 8.1.1 QFN-64 An example of the markings on the QFN package are shown in Figure 8-1. The FTDI part number is too long for the 64 QFN package so in this case the last two digits are wrapped down onto the date code line. Notes: 1. YYWW = Date Code, where YY is year and WW is week number 2. Marking alignment should be centre justified 3. Laser Marking should be used FTDI XXXXXXXXXX FT313HQ Line 1 – FTDI Logo Line 4 – Date Code, Revision Line 2 – Wafer Lot Number 1 64 Line 3 – FTDI Part Number YYWW-B Figure 8-1 QFN Package Markings |
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