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ACST310-8FP Datasheet(PDF) 11 Page - STMicroelectronics |
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ACST310-8FP Datasheet(HTML) 11 Page - STMicroelectronics |
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11 / 14 page ![]() DocID027577 Rev 2 11/14 ACST310-8FP Package information 14 3 Package information • Epoxy meets UL94-V0 • Halogen free molding compound • Lead-free package • Recommended torque: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 3.1 TO-220FPAB package information Figure 19. TO-220FPAB package outline |
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