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STM32F302XD Datasheet(PDF) 158 Page - STMicroelectronics |
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STM32F302XD Datasheet(HTML) 158 Page - STMicroelectronics |
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158 / 168 page ![]() Package information STM32F302xD STM32F302xE 158/168 DocID026900 Rev 4 Figure 64. Recommended footprint for the WLCSP100 package Table 96. WLCSP100 package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Typ Min Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2 - 0.38 - - 0.0150 - A3(2) 2. Back side coating. - 0.025 - - 0.0010 - Ø b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.22 0.25 0.28 - 0.0098 0.0110 D 4.74 4.775 4.81 - 0.1880 0.1894 E 5.006 5.041 5.076 - 0.1985 0.1998 e - 0.4 - - 0.0157 - e1 - 3.6 - - 0.1417 - e2 - 3.6 - - 0.1417 - F - 0.5875 - - 0.0231 - G - 0.7205 - - 0.0284 - N - 100 - - 3.9370 - aaa - 0.1 - - 0.0039 - bbb - 0.1 - - 0.0039 - ccc - 0.1 - - 0.0039 - ddd - 0.05 - - 0.0020 - eee - 0.05 - - 0.0020 - |
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