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STM32F302XD Datasheet(PDF) 159 Page - STMicroelectronics |
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STM32F302XD Datasheet(HTML) 159 Page - STMicroelectronics |
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159 / 168 page  DocID026900 Rev 4 159/168 STM32F302xD STM32F302xE Package information 166 Device marking for WLCSP100 The following figure gives an example of topside marking orientation versus pin 1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 65. WLCSP100 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. Table 97. WLCSP100 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 mm Dpad 0.225 mm Dsm 0.290 mm Stencil thickness 0.1 mm |
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