STM32F358XC datasheet(56/134 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32F358xC

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DocID025540 Rev 4

6.3

Operating conditions

6.3.1

General operating conditions

Table 24. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

MHz

fPCLK1

Internal APB1 clock frequency

fPCLK2

Internal APB2 clock frequency

VDD

Standard operating voltage

1.65

1.95

VDDA

Analog operating voltage

(OPAMP and DAC not used)

Must have a potential

equal to or higher than

VDD

1.65

3.6

Analog operating voltage

(OPAMP and DAC used)

2.4

3.6

Analog operating voltage

(ADC used)

1.8 V

3.6 V

VBAT

Backup operating voltage

1.65

3.6

VIN

I/O input voltage

TC I/O

–0.3

VDD+0.3

TTa I/O and POR I/O pins

–0.3

VDDA+0.3

FT, FTf I/O pins

–0.3

5.2

BOOT0

5.2

Power dissipation at TA =

85 °C for suffix 6 or TA =

105 °C for suffix 7(1)

1. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 23: Thermal

characteristics).

LQFP100

488

LQFP64

444

LQFP48

364

Ambient temperature for 6

suffix version

Maximum power

dissipation

–40

°C

Low-power dissipation(2)

2. In low-power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see

Table 23: Thermal characteristics).

–40

105

Ambient temperature for 7

suffix version

Maximum power

dissipation

–40

105

°C

Low-power dissipation(2)

–40

125

Junction temperature range

6 suffix version

–40

105

°C

7 suffix version

–40

125

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