T330P

www.vishay.com

Vishay Semiconductors

Rev. 1.2, 22-May-14

3

Document Number: 83490

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

HANDLING AND STORAGE CONDITIONS

• The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only.

It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment.

• Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as

defined in MIL-HDBK-263.

• Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used.

PACKING

Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the

wafers are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence

(humidity and contamination).

Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take

back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for

packing material that is returned unsorted or which we are not obliged to accept.