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PIC18F4539-E/MLSQTP Datasheet(PDF) 306 Page - Microchip Technology |
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PIC18F4539-E/MLSQTP Datasheet(HTML) 306 Page - Microchip Technology |
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306 / 322 page ![]() PIC18FXX39 DS30485A-page 304 Preliminary 2002 Microchip Technology Inc. 44-Lead Quad Flat No Lead Package (ML) 8x8 mm Body (QFN) Land Pattern and Solder Mask Pad Width *Controlling Parameter Drawing No. C04-2103 B ____________ Pitch MAX Units Dimension Limits p INCHES .026 BSC MIN NOM MAX MILLIMETERS* MIN 0.65 BSC NOM Pad Length Pad to Solder Mask L ____________ M .005 .006 0.13 0.15 p M M B PACKAGE EDGE SOLDER MASK |
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