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© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 03 — 31 January 2005

11 of 14

Philips Semiconductors

74LVC3G34

Triple buffer gate

Fig 9.

Package outline SOT833-1 (XSON8)

terminal 1

index area

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT833-1

- - -

MO-252

- - -

SOT833-1

04-07-22

04-11-09

DIMENSIONS (mm are the original dimensions)

XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm

D

E

e

b

L

0

1

2 mm

scale

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

UNIT

mm

0.25

0.17

2.0

1.9

0.35

0.27

max

b

E

1.05

0.95

D

L

0.40

0.32

0.5

0.6

max

0.5

0.04

1

8

2

7

3

6

4

5

8

×

(2)

4

×

(2)

A