14

LT6210/LT6211

62101f

SI PLIFIED SCHE ATIC

–IN

8k

4

OUT

1

5

2

6

SUPPLY

CURRENT

CONTROL

600

Ω

600

Ω

6210 SS

OUTPUT BIAS

CONTROL

+IN

3

PACKAGE DESCRIPTIO

TYPICAL APPLICATIO

The response of the cable driver with a 1MHz sinusoid is

shown in Figure 4. The circuit is capable of transmitting

Small signal –3dB bandwidth extends from 1kHz to

56MHz with the selected coupling capacitors.

DD Package

10-Lead Plastic DFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1699)

3.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).

CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT

2. ALL DIMENSIONS ARE IN MILLIMETERS

3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

2.38

±0.10

(2 SIDES)

1

5

10

6

PIN 1

TOP MARK

(SEE NOTE 5)

0.200 REF

0.00 – 0.05

(DD10) DFN 0403

0.25

± 0.05

2.38

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.15

±0.05

0.50

BSC

0.675

±0.05

3.50

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

4. EXPOSED PAD SHALL BE SOLDER PLATED

5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

–

+

LT6210

15

Ω

1%

249

Ω

1%

2k

1%

2.2

µF

154

Ω

1%

1.3k

1%

2k

1%

50

Ω

6210 F03

3V

3V

6

4

3

1

2

5

2.2

µF

3300pF

NPO

1V/DIV

1V/DIV

1V/DIV

200ns/DIV

6210 F04

Figure 3. 3V Cable Driver with Active Termination

Figure 4. Response of Circuit at 1MHz