Data Sheet

ADF5902

Rev. 0 | Page 39 of 39

OUTLINE DIMENSIONS

0.50

0.40

0.30

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.20 MIN

3.75

3.60 SQ

3.55

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 54. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-12)

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADF5902WCCPZ

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-12

ADF5902WCCPZ-RL7

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-12

EV-ADF5902SD1Z

Evaluation Board

AUTOMOTIVE PRODUCTS

The ADF5902W models are available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in

automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these models.

©2018 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D16746-0-12/18(0)