2225B104F152CT datasheet(6/10 Pages) WALSIN

6 / 10 page

Multilayer Ceramic Capacitors

Approval Sheet

Page 6 of 10

ASC_1825 2220 2225_025I_DS

May. 2019

6. RELIABILITY TEST CONDITIONS AND REQUIREMENTS

No.

Item

Test Condition

Requirements

1. Visual and

Mechanical

---

* No remarkable defect.

* Dimensions to conform to individual specification sheet.

2. Capacitance

Class I: (NP0)

≤1000pF, 1.0±0.2Vrms，1MHz±10%

C>1000pF, 1.0±0.2Vrms，1KHz±10%

Class II: (X7R)

≤10µF, 1.0±0.2Vrms，1KHz±10%

C>10µF, 0.5±0.2Vrms，120Hz±20%

At 25°C ambient temperature.

* Shall not exceed the limits given in the detailed spec.

3. Q/ D.F.

(Dissipation

Factor)

* Q/DF:

NP0: Cap

≥30pF, Q≥1000; Cap<30pF,Q≥400+20C.

X7R:

≤2.5%.

4. Dielectric

Strength

*To apply voltage (

≤100V) 250%.

*Duration: 1 to 5 sec.

*Charge & discharge current less than 50mA.

* No evidence of damage or flash over during test.

*To apply voltage:

200V ~ 300V

≥ 2 times V DC

500V ~ 999V

≥ 1.5 times V DC

1000V ~ 3000V

≥ 1.2 times V DC

4000V

≥ 1.1 times V DC

*Duration: 1 to 5 sec.

*Charge & discharge current less than 50mA.

5. Insulation

Resistance

≤100V: To apply voltage at U

R for max. 120 sec.

UR>100V: To apply voltage at UR (500V max.) for 60 sec.

≥10G or R•C≥100 -F whichever is smaller.

6. Temperature

Coefficient

With no electrical load.

T.C.

Operating Temp

NP0

-55~125°C at 25°C

X7R

-55~125°C at 25°C

* Capacitance change:

NP0: Within ±30ppm/°C.

X7R: Within ±15%.

7. Adhesive

Strength of

Termination

* Pressurizing force：10N

* Test time: 10±1 sec.

* No remarkable damage or removal of the terminations.

8. Vibration

Resistance

* Vibration frequency: 10~55 Hz/min.

* Total amplitude: 1.5mm

* Test time: 6 hrs. (Two hrs each in three mutually perpendicular

directions.)

* No remarkable damage.

* Cap change and Q/D.F.: To meet initial spec.

9. Solderability

* Solder temperature: 235±5°C

* Dipping time: 2±0.5 sec.

75% min. coverage of all metalized area.

10. Bending Test

* The middle part of substrate shall be pressurized by means of the

pressurizing rod at a rate of about 1 mm per second until the

deflection becomes 1 mm and then the pressure shall be maintained

for 5±1 sec.

* Measurement to be made after keeping at room temp. for 24±2 hrs.

* No remarkable damage.

* Cap change: NP0: within ±5% or 0.5pF whichever is larger.

X7R: within ±12.5%.

(This capacitance change means the change of capacitance

under specified flexure of substrate from the capacitance

measured before the test.)

11. Resistance to

Soldering Heat

* Solder temperature: 260±5°C

* Dipping time: 10±1 sec

* Preheating: 120 to 150°C for 1 minute before imme rse the capacitor

in a eutectic solder.

* Before initial measurement (Class II only): Perform 150+0/-10°C for

1 hr and then set for 24±2 hrs at room temp.

* Measurement to be made after keeping at room temp. for 24±2 hrs.

* No remarkable damage.

* Cap change:NP0: within ±2.5% or 0.25pF whichever is larger.

X7R: within ±7.5%.

* Q/D.F., I.R. and dielectric strength: To meet initial

requirements.

* 25% max. leaching on each edge.

12. Temperature

Cycle

* Conduct the five cycles according to the temperatures and time.

Step

Temp. (°C)

Time (min.)

Min. operating temp. +0/-3

30±3

Room temp.

2~3

Max. operating temp. +3/-0

30±3

Room temp.

2~3

* Before initial measurement (Class II only): Perform 150+0/-10°C for

1 hr and then set for 24±2 hrs at room temp.

* Measurement to be made after keeping at room temp. for 24±2 hrs.

* No remarkable damage.

* Cap change：

NP0: within ±2.5% or 0.25pF whichever is larger.

X7R: within ±7.5%.

* Q/D.F.:

NP0: To meet initial requirements.

X7R:

≤1.5 × Initial requirements.

* I.R: To meet initial requirements.

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