Multilayer Ceramic Capacitors

Approval Sheet

Page 9 of 10

ASC_1825 2220 2225_025I_DS

May. 2019

APPLICATION NOTES

◙ Storage

To prevent the damage of solderability of terminations, the following storage conditions are

recommended:

Indoors under 5 ~ 40°C and 20% ~ 70% RH.

No harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine.

Packaging should not be opened until the capacitors are required for use. If opened, the pack should be

re-sealed as soon as is practicable. Taped product should be stored out of direct sunlight, which might

promote deterioration in tape or adhesion performance. The capacitors should be used within 6 months and

checked the solderability before use.

◙ Handling

Chip capacitors are dense, hard, brittle, and abrasive materials. They are liable to suffer mechanical

damage, in the form of cracks or chips. Chip Capacitors should be handled with care to avoid contamination

or damage. To use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual

placement. Tape and reeled packages are suitable for automatic pick and placement machine.

◙ Preheat

In order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required.

The rate of preheat should not exceed 4°C per secon d and the final preheat temperature should be within

100°C of the soldering temperature for small chips such as 0402, 0603, 0805 and 1206, within 50°C of t he

soldering temperature for bigger chips such as 1210, 1808, 1812, 1825, 2220 and 2225, etc.

◙ Soldering

Use middy activated rosin RA and RMA fluxes do not use activated flux. The amount of solder in each

solder joint should be controlled to prevent the damage of chip capacitors caused by the stress between

solder, chips, and substrate.

Hand soldering with temperature-controlled iron not exceeding 30 watts and diameter of tip less than 1.2

mm is recommended, tip of iron should not contact the ceramic body directly, and the temperature of iron

should be set to not more than 260°C.

For bigger chips such as 1210, 1808, 1812, 2220 and 2225, etc. wave soldering and hand soldering are

no recommended.

Refer IPC/JEDEC J-STD-020D Method recommended soldering profiles:

Reflow not sooner than 15 minutes and not longer than 4 hrs after removal from the

temperature/humidity chamber, subject the sample to 3 cycle of the appropriate reflow conditions as defined

as blow Table description.

Profile Feature

Pb-Free Assembly

Preheat/Soak

150°C

200°C

60 to 120 seconds

3°C/second max.

217°C

60 to 150 seconds

Classification temp 260°C

Classification temp 260°C

30* second

6°C/second max.

Time 25°C to peak temperature 260°C

8 minutes max.