STM32G071C8 datasheet(66/133 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32G071x8/xB

66/133

DS12232 Rev 3

5.3.6

Wakeup time from low-power modes and voltage scaling

transition times

The wakeup times given in Table 34 are the latency between the event and the execution of

the first user instruction.

TIM17

APB

0.7

0.5

LPTIM1

APB

3.2

2.7

3.0

LPTIM2

APB

3.1

2.5

3.0

I2C1

APB

3.8

3.1

3.5

I2C2

APB

0.7

0.6

1.0

SPI2

APB

1.5

1.2

1.0

USART1

APB

7.2

6.0

6.5

USART2

APB

7.2

6.0

USART3

APB

2.0

1.7

2.0

USART4

APB

2.0

1.7

2.0

LPUART1

APB

4.3

3.5

4.0

CEC

APB

0.4

0.3

0.5

UCPD1

APB

4.0

7.7

NA(2)

UCPD2

APB

4.0

7.7

NA(2)

ADC

APB

2.0

1.7

2.0

DAC

APB

2.2

1.8

2.0

1. The AHB to APB Bridge is automatically active when at least one peripheral is ON on the APB.

2. UCPDx are always clocked by HSI16.

Table 33. Current consumption of peripherals (continued)

Peripheral

Bus

Consumption in µA/MHz

Range 1

Range 2

Low-power run

and sleep

Table 34. Low-power mode wakeup times(1)

Symbol

Parameter

Conditions

Typ

Max

Unit

tWUSLEEP

Wakeup time from

Sleep to Run

mode

-11

CPU

cycles

tWULPSLEEP

Wakeup time from

Low-power sleep

mode

Transiting to Low-power-run-mode execution in Flash

memory not powered in Low-power sleep mode;

HCLK = HSI16 / 8 = 2 MHz

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