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STM32G031F6 Datasheet(PDF) 109 Page - STMicroelectronics |
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STM32G031F6 Datasheet(HTML) 109 Page - STMicroelectronics |
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109 / 117 page ![]() DS12992 Rev 2 109/117 STM32G031x4/x6/x8 Package information 112 Figure 51. WLCSP18 recommended PCB ball footprint A2 - 0.38 - - 0.015 - A3(3) - 0.025 - - 0.001 - b(4) 0.22 0.25 0.28 0.009 0.010 0.011 D 1.84 1.86 1.88 0.072 0.073 0.074 E 2.12 2.14 2.16 0.083 0.084 0.085 e - 0.40 - - 0.016 - e1 - 1.20 - - 0.047 - e2 - 1.39 - - 0.055 - F(5) - 0.345 - - 0.014 - G(5) - 0.390 - - 0.015 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 1. Values in inches are converted from mm and rounded to four decimal digits. 2. The maximum total package height is calculated by the RSS method (root sum square) using nominal and tolerance values of A1 and A2. 3. Back side coating. Nominal dimension is rounded to three decimal places, which results from the process capability. 4. Dimension is measured at the maximum ball diameter parallel to primary datum Z. 5. Calculated dimensions are rounded to the three decimal places. Table 77. WLCSP18 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. B06E_WLCSP18_DIE466_FP_V1 Dpad Dsm |
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