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STM32G031F6 Datasheet(PDF) 109 Page - STMicroelectronics

Part # STM32G031F6
Description  Arm® Cortex®-M0 32-bit MCU, up to 64 KB Flash, 8 KB RAM, 2x USART, timers, ADC, comm. I/Fs, 1.7-3.6V
PDF  117 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G031F6 Datasheet(HTML) 109 Page - STMicroelectronics

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DS12992 Rev 2
109/117
STM32G031x4/x6/x8
Package information
112
Figure 51. WLCSP18 recommended PCB ball footprint
A2
-
0.38
-
-
0.015
-
A3(3)
-
0.025
-
-
0.001
-
b(4)
0.22
0.25
0.28
0.009
0.010
0.011
D
1.84
1.86
1.88
0.072
0.073
0.074
E
2.12
2.14
2.16
0.083
0.084
0.085
e
-
0.40
-
-
0.016
-
e1
-
1.20
-
-
0.047
-
e2
-
1.39
-
-
0.055
-
F(5)
-
0.345
-
-
0.014
-
G(5)
-
0.390
-
-
0.015
-
aaa
-
-
0.10
-
-
0.004
bbb
-
-
0.10
-
-
0.004
ccc
-
-
0.10
-
-
0.004
ddd
-
-
0.05
-
-
0.002
eee
-
-
0.05
-
-
0.002
1. Values in inches are converted from mm and rounded to four decimal digits.
2. The maximum total package height is calculated by the RSS method (root sum square) using nominal and
tolerance values of A1 and A2.
3. Back side coating. Nominal dimension is rounded to three decimal places, which results from the process
capability.
4. Dimension is measured at the maximum ball diameter parallel to primary datum Z.
5. Calculated dimensions are rounded to the three decimal places.
Table 77. WLCSP18 package mechanical data (continued)
Symbol
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
Max.
B06E_WLCSP18_DIE466_FP_V1
Dpad
Dsm



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