STM32G031F6 datasheet(110/117 Pages) STMICROELECTRONICS

110 / 117 page

Package information

STM32G031x4/x6/x8

110/117

DS12992 Rev 2

Device marking

The following figure gives an example of topside marking orientation versus ball A1 identifier

location.

The printed markings may differ depending on the supply chain.

Other optional marking or inset/upset marks that identify the parts throughout supply chain

operations, are not indicated below.

Figure 52. WLCSP18 package marking example

1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified

and therefore not approved for use in production. ST is not responsible for any consequences resulting

from such use. In no event will ST be liable for the customer using any of these engineering samples in

production. ST's Quality department must be contacted prior to any decision to use these engineering

samples to run a qualification activity.

6.8

SO8N package information

SO8N is an 8-lead 4.9 x 6 mm plastic small-outline package with 150 mils body width.

Table 78. WLCSP18 recommended PCB design rules

Dimension

Recommended values

Pitch

0.4 mm

Dpad

0,225 mm

Dsm

0.290 mm typ. (depends on solder mask registration tolerance)

Stencil opening

0.250 mm

Stencil thickness

0.100 mm

MSv63115V1

Ball A1

indentifier

Revision code

Date code

Product

identification

(1)

G318

Y WW R

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