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STM32L021D4 Datasheet(PDF) 46 Page - STMicroelectronics

Part # STM32L021D4
Description  Access line ultra-low-power 32-bit MCU Arm®-based Cortex®-M0, 16KB Flash, 2KB SRAM, 512B EEPROM, ADC, AES
PDF  114 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L021D4 Datasheet(HTML) 46 Page - STMicroelectronics

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Electrical characteristics
STM32L021x4
46/114
DocID027982 Rev 5
6.2
Absolute maximum ratings
Stresses above the absolute maximum ratings listed in Table 14: Voltage characteristics,
Table 15: Current characteristics, and Table 16: Thermal characteristics may cause
permanent damage to the device. These are stress ratings only and functional operation of
the device at these conditions is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability. Device mission profile (application conditions)
is compliant with JEDEC JESD47 Qualification Standard. Extended mission profiles are
available on demand.
Table 14. Voltage characteristics
Symbol
Ratings
Min
Max
Unit
VDD–VSS
External main supply voltage
(including VDDA, VDD)(1)
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power
supply, in the permitted range.
–0.3
4.0
V
VIN(2)
2.
VIN maximum must always be respected. Refer to Table 15 for maximum allowed injected current values.
Input voltage on FT and FTf pins
VSS −0.3
VDD+4.0
Input voltage on TC pins
VSS −0.3
4.0
Input voltage on BOOT0
VSS
VDD +4.0
Input voltage on any other pin
VSS −0.3
4.0
|
ΔVDD|
Variations between different VDDx power pins
-
50
mV
|VDDA-VDDx|
Variations between any VDDx and VDDA power
pins(3)
3. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and device operation. its value does not need to
respect this rule.
-
300
|
ΔVSS|
Variations between all different ground pins
-
50
VESD(HBM)
Electrostatic discharge voltage
(human body model)
see Section 6.3.11



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