ADPA7004CHIP-SX datasheet(19/20 Pages) AD

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Data Sheet

ADPA7004CHIPS

Rev. 0 | Page 19 of 20

MOUNTING AND BONDING TECHNIQUES FOR

MILLIMETERWAVE GaAs MMICS

Attach the die directly to the ground plane with high thermal

conductivity epoxy (see the Handling Precautions section, the

Mounting section, and the Wire Bonding section).

Microstrip, 50 Ω transmission lines on 0.127 mm (5 mil) thick

alumina, thin film substrates are recommended for bringing

the RF to and from the chip. Raise the die 0.076 mm (3 mil) to

ensure that the surface of the die is coplanar with the surface of

the substrate.

Place microstrip substrates as close to the die as possible to

minimize ribbon bond length. Typical die to substrate spacing

is 0.076 mm (3 mil). To ensure wideband matching, a 15 fF

capacitive stub is recommended on the transmission line before

the ribbon bond.

MMIC

3mil GOLD

RIBBON

3mil GA

RFIN

MATCHING STUB/BOND PAD

SHUNT CAPACITANCE = 15fF

50Ω

TRANSMISSION LINE

Figure 49. High Frequency Input Matching

MMIC

3mil GOLD

RIBBON

3mil GA

RFOUT

MATCHING STUB/BOND PAD

SHUNT CAPACITANCE = 15fF

50Ω

TRANSMISSION LINE

Figure 50. High Frequency Output Matching

Handling Precautions

To avoid permanent damage, follow these storage, cleanliness,

static sensitivity, transient, and general handling precautions:

•

Place all bare die in either waffle-based or gel-based ESD

protective containers and then seal the die in an ESD

protective bag for shipment. After the sealed ESD

protective bag is opened, store all die in a dry nitrogen

environment.

•

Handle the chip in a clean environment. Do not attempt to

clean the chip using liquid cleaning systems.

•

Follow ESD precautions to protect against ESD strikes.

•

While bias is applied, suppress instrument and bias supply

transients. Use shielded signal and bias cables to minimize

inductive pickup.

•

Handle the chip along the edges with a vacuum collet or

with a sharp pair of tweezers. The surface of the chip has

fragile air bridges and must not be touched with vacuum

collet, tweezers, or fingers.

Mounting

Before epoxy die is attached, apply a minimum amount of

epoxy to the mounting surface so that a thin epoxy fillet is

observed around the perimeter of the chip after it is placed into

position. Cure the epoxy per the schedule of the manufacturer.

Wire Bonding

RF bonds made with 0.003 in. × 0.0005 in. gold ribbon are

recommended for the RF ports. These bonds must be

thermosonically bonded with a force of 40 g to 60 g. DC bonds

of 0.001 in. (0.025 mm) diameter, thermosonically bonded, are

recommended. Create ball bonds with a force of 40 g to 50 g

and wedge bonds with a force of 18 g to 22 g. Create all bonds

with a nominal stage temperature of 150°C. Apply a minimum

amount of ultrasonic energy to achieve reliable bonds. Keep all

bonds as short as possible, less than 12 mil (0.31 mm).

Alternatively, short (≤3 mil) RF bonds made with two 1 mil

wires can be used.

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