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MSCSM170AM058CT6LIAG Datasheet(PDF) 12 Page - Microchip Technology |
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MSCSM170AM058CT6LIAG Datasheet(HTML) 12 Page - Microchip Technology |
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12 / 17 page ![]() 2. Package Specifications The following section shows the package specification of the MSCSM170AM058CT6LIAG device. 2.1 Package Outline The following figure shows the package outline drawing of the MSCSM170AM058CT6LIAG device. The dimensions in the following figure are in millimeters. Figure 2-1. Package Outline Drawing Note: See AN1911—Mounting Instructions for SP6 Low Inductance Power Module for more information. MSCSM170AM058CT6LIAG Package Specifications © 2021 Microchip Technology Inc. Datasheet DS00003946A-page 12 |
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