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STM32H750VB Datasheet(PDF) 330 Page - STMicroelectronics |
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STM32H750VB Datasheet(HTML) 330 Page - STMicroelectronics |
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330 / 335 page  DS12556 Rev 5 329/334 STM32H750VB STM32H750ZB STM32H750IB STM32H750XB Package information 331 8.6 Thermal characteristics The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max × JA) Where: TA max is the maximum ambient temperature in C, JA is the package junction-to-ambient thermal resistance, in C/W, PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = (VOL × IOL) + ((VDD – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. Table 222. Thermal characteristics Symbol Definition Parameter Value Unit JA Thermal resistance junction-ambient Thermal resistance junction-ambient LQFP100 - 14 x 14 mm /0.5 mm pitch 45.0 °C/W Thermal resistance junction-ambient LQFP144 - 20 x 20 mm /0.5 mm pitch 43.7 Thermal resistance junction-ambient LQFP176 - 24 x 24 mm /0.5 mm pitch 43.0 Thermal resistance junction-ambient UFBGA176+25 - 10 x 10 mm /0.65 mm pitch 37.4 Thermal resistance junction-ambient TFBGA240+25 - 14 x 14 mm / 0.8 mm pitch 36.6 JB Thermal resistance junction-board Thermal resistance junction-ambient LQFP100 - 14 x 14 mm /0.5 mm pitch 36.3 °C/W Thermal resistance junction-ambient LQFP144 - 20 x 20 mm /0.5 mm pitch 38.3 Thermal resistance junction-ambient LQFP176 - 24 x 24 mm /0.5 mm pitch 43.0 Thermal resistance junction-ambient UFBGA176+25 - 10 x 10 mm /0.65 mm pitch 19.3 Thermal resistance junction-ambient TFBGA240+25 - 14 x 14 mm / 0.8 mm pitch 24.3 |
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