STM32F303X6 datasheet(96/124 Pages) STMICROELECTRONICS

96 / 124 page

Electrical characteristics

STM32F303x6/x8

96/124

DS9866 Rev 8

Figure 31. Typical connection diagram using the ADC

1. Refer to Table 60 for the values of RAIN.

2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the

pad capacitance (roughly 7 pF). A high Cparasitic value downgrades conversion accuracy. To remedy this,

fADC must be reduced.

General PCB design guidelines

Power supply decoupling must be performed as shown in Figure 12: Power-supply scheme.

The 10 nF capacitor must be ceramic (good quality) and it must be placed as close as

possible to the chip.

6.3.19

DAC electrical specifications

12-bit

converter

Sample and hold ADC

converter

RAIN(1)

AINx

VAIN

Cparasitic

VDD

0.6 V

IL ± 1 μA

RADC

CADC

MS19881V3

Table 65. DAC characteristics

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Unit

VDDA

Analog supply voltage

2.4

3.6

RLOAD(1) Resistive load

DAC output buffer ON (to VSSA)5

-k

DAC output buffer ON (to VDDA)25

RO(1)

Output impedance

DAC output buffer OFF

CLOAD(1) Capacitive load

DAC output buffer ON

VDAC_OUT(

Voltage on DAC_OUT

output

Corresponds to 12-bit input code

(0x0E0) to (0xF1C) at VDDA = 3.6 V

and (0x155) and (0xEAB) at VDDA =

2.4 V

0.2

VDDA – 0.2

DAC output buffer OFF

-0.5

VDDA– 1LSB

IDDA(3)

DAC DC current

consumption in quiescent

mode(2)

With no load, middle code (0x800)

on the input

380

µA

With no load, worst code (0xF1C) on

the input.

480

µA

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