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STM8S903K3 Datasheet(PDF) 93 Page - STMicroelectronics |
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STM8S903K3 Datasheet(HTML) 93 Page - STMicroelectronics |
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93 / 124 page ![]() DocID15590 Rev 12 93/124 STM8S903K3 STM8S903F3 Package information 108 11.2 UFQFPN32 package information Figure 48. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. 4. Dimensions are in millimeters. |
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