STM32WB15CC datasheet(116/127 Pages) STMICROELECTRONICS

Part #	STM32WB15CC

Description	Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.2 radio solution

PDF	127 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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116 / 127 page

Package information

STM32WB15CC

116/127

DS13258 Rev 4

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

7.1

UFQFPN48 package information

UFQFPN48 is a 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package.

Figure 27. UFQFPN48 outline

1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package, it must be electrically connected to

the PCB ground.

A0B9_ME_V3

Pin 1 identifier

laser marking area

Exposed pad

area

Detail Z

R 0.125 typ.

C 0.500x45°

pin1 corner

Seating

plane

ddd

Detail Y

STM32WB15CC Datasheet(PDF) 116 Page - STMicroelectronics