ST25R3918 datasheet(124/141 Pages) STMICROELECTRONICS

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Electrical characteristics

ST25R3918

124/141

DS13490 Rev 2

Electrical characteristics

5.1

Absolute maximum ratings

Any stress beyond the limits listed in Table 108 may cause permanent damage to the

device. These are stress ratings only.

Functional operation of the device at these or any other conditions beyond those indicated

in Table 108 is not implied. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.

Table 108. Absolute maximum ratings

Symbol

Parameter

Min

Max

Unit

VDD, VDD_TX(1)

1. Referenced to VSS.

Positive supply voltage

-0.3

6.0

VDD, VDD_TX(1)(2)

2. Bit sup3V set to 1 in IO configuration register 2.

Positive supply voltage when option bit sup3V is set

-0.3

∆VDD-VDD_TX(1) Difference between VDD and VDD_TX

-0.3

0.3

VDD_IO(1)

Peripheral communication supply voltage

-0.3

VGND(1)

Negative supply voltage

-0.3

0.3

VpIO(1)

Voltage for peripheral IO communication pins (27 to 32)

-0.3

Vp5V(1)

Voltage for other pins (9, 11, 13, 14, 15, and 17)

in the 5 V domain

-0.3

Vp3V(1)

Voltage for other pins (2 to 5, 7, 18, 19, 20 and 22 to 25)

in the 3 V domain

-0.3

Iscr

Input current (latch-up immunity) according to JESD78

-100

100

IVDD_LDO

Maximum driver current using internal voltage regulator

85(3)

3. Provide good thermal management to ensure that junction temperature remains below the specified value.

IVDD_EXT(4)

4. VDD_RF is connected to VDD_TX to bypass the internal voltage regulator.

Peak current supplied from an external source, internal

voltage regulator bypassed

125(5)

5. Peak current with RF driver externally supplied. Provide good thermal management to ensure that junction

temperature remains below the specified value.

ESD voltage

Electrostatic discharge voltage according to JS-001,

human body model

2000

Tstrg

Storage temperature

-65

150

°C

Tbody

Package body temperature according to IPC/JEDEC

J-STD-020(6)

6. Reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices”.

260

TJun

Junction temperature

-40

125

Humidity non-condensing

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