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ADMV8526ACCZ-R7 Datasheet(PDF) 15 Page - Analog Devices |
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ADMV8526ACCZ-R7 Datasheet(HTML) 15 Page - Analog Devices |
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15 / 31 page ![]() Data Sheet ADMV8526 APPLICATIONS INFORMATION analog.com Rev. 0 | 15 of 31 INTERPOLATION COEFFICIENTS For reference, the ADMV8526 interpolation coefficients that were used for device characterization are listed in Table 11. These inter- polation coefficients are provided as a good starting point for use in a system. Depending upon the system requirements and allowable process tolerance, some minor adjustments may be needed to the interpolation coefficients. For most applications, the device process tolerance within a particular lot of material allows for one set of interpolation coefficients, such that interpolation coefficient calibration only needs to be performed once per lot. Refer to the Interpolation Coefficient Calibration section for more information on how to adjust the interpolation coefficients. Table 11. Interpolation Coefficients Interpolation Coefficients Coefficient Bit Field Narrow Bandwidth (7%) Nominal Bandwidth (9%) Wide Bandwidth (11%) Y0 INTERP_FC_Y0 233 239 246 Y1 INTERP_FC_Y1 196 201 207 Y2 INTERP_FC_Y2 164 169 174 Y3 INTERP_FC_Y3 117 120 123 Y4 INTERP_FC_Y4 89 91 93 Y5 INTERP_FC_Y5 67 68 70 Y6 INTERP_FC_Y6 50 51 52 Y7 INTERP_FC_Y7 38 39 39 Y8 INTERP_FC_Y8 28 28 28 Y9 INTERP_FC_Y9 20 20 20 V0 INTERP_BW_V0 4 0 0 V1 INTERP_BW_V1 17 5 0 V2 INTERP_BW_V2 112 64 16 T0 INTERP_MATCH_T0 1 5 0 T1 INTERP_MATCH_T1 21 30 33 T2 INTERP_MATCH_T2 139 178 239 PRINTED CIRCUIT BOARD (PCB) DESIGN GUIDELINES The PCB used to implement the ADMV8526 can use standard quality dielectric materials between the top metallization layer and internal ground layer, such as the Isola 370HR. Rogers 4003 or the Rogers 4350 do not have to be used. The characteristic impedance of the transmission lines to the RF1 and RF2 pins of the ADMV8526 must be controlled to 50 Ω to ensure optimal RF performance. Connect the GND pins and exposed pads of the ADMV8526 directly to the ground plane of the PCB. Use a sufficient number of via holes to connect the top and bottom ground planes of the PCB. |
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