ADGM1304JCPZ-R2 datasheet(9/34 Pages) AD

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Data Sheet

ADGM1304

Rev. G | Page 9 of 34

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

VDD to AGND

−0.3 V to +6 V

Digital Inputs1

−0.3 V to VDD + 0.3 V or 30 mA

(whichever occurs first)

DC Voltage Rating2

±7 V

VCPEXT

82 V

Current Rating2

250 mA

RF Power Rating

37 dBm

Standoff Voltage3

RFx to AGND

±10 V

RFC to AGND

±10 V

RFx to RFC

20 V

Operating Temperature Range

0°C to +85°C

Storage Temperature Range

−65°C to +150°C

Reflow Soldering (Pb-Free)

Peak Temperature

260(+0/−5)°C

Time at Peak Temperature

10 sec to 30 sec

Electrostatic Discharge (ESD)

Human Body Model (HBM)4

RF1, RF2, RF3, RF4 and RFC

100 V

All Other Pins

2.5 kV

Field-Induced Charged-

Device Model (FICDM)5

All Pins

500 V

Group D

Mechanical Shock6

1500 g with 0.5 ms pulse

Vibration

20 Hz to 2000 Hz acceleration

at 50 g

Constant Acceleration

30,000 g

Clamp overvoltages at INx pin by internal diodes. Limit the current to the

maximum ratings given.

This rating is with respect to the switch in the on position with no RF signal

applied.

This rating is with respect to the switch in the off position.

Take proper precautions during handling, as detailed in the Handling

Precautions section.

A safe automated handling and assembly process is achieved at this rating

level by implementing industry-standard ESD controls.

If the device is dropped during handling, do not use the device.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

Only one absolute maximum rating can be applied at any

one time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the junction to ambient thermal resistance.

θJC is the junction to case thermal resistance.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-24-91

49.1

11.5

°C/W

See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance (PCB with 3 × 3 vias).

ESD CAUTION

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