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PPC5605BAMLL4R Datasheet(PDF) 47 Page - NXP Semiconductors |
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PPC5605BAMLL4R Datasheet(HTML) 47 Page - NXP Semiconductors |
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47 / 114 page ![]() Electrical characteristics MPC5607B Microcontroller Data Sheet, Rev. 10 NXP Semiconductors 47 4.6.5 I/O pad current specification The I/O pads are distributed across the I/O supply segment. Each I/O supply segment is associated to a VDD/VSS supply pair as described in Table 21. Table 22 provides I/O consumption figures. In order to ensure device reliability, the average current of the I/O on a single segment should remain below the IAVGSEG maximum value. ttr CC D Output transition time output pin2 MEDIUM configuration CL = 25 pF VDD = 5.0 V ± 10%, PAD3V5V = 0 SIUL.PCRx.SRC = 1 — — 10 ns TCL = 50 pF — — 20 DCL = 100 pF — — 40 DCL = 25 pF VDD = 3.3 V ± 10%, PAD3V5V = 1 SIUL.PCRx.SRC = 1 —— 12 TCL = 50 pF — — 25 DCL = 100 pF — — 40 ttr CC D Output transition time output pin2 FAST configuration CL = 25 pF VDD = 5.0 V ± 10%, PAD3V5V = 0 —— 4 ns CL = 50 pF — — 6 CL = 100 pF — — 12 CL = 25 pF VDD = 3.3 V ± 10%, PAD3V5V = 1 —— 4 CL = 50 pF — — 7 CL = 100 pF — — 12 1 V DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C, unless otherwise specified 2 C L includes device and package capacitances (CPKG < 5 pF). Table 21. I/O supply segments Package Supply segment 12345 678 208 MAPBGA1 1 208 MAPBGA available only as development package for Nexus2+ Equivalent to 176 LQFP segment pad distribution MCKO MDOn /MSEO 176 LQFP pin7 – pin27 pin28 – pin57 pin59 – pin85 pin86 – pin123 pin124 – pin150 pin151 – pin6 — — 144 LQFP pin20 – pin49 pin51 – pin99 pin100 – pin122 pin 123 – pin19 — — — — 100 LQFP pin16 – pin35 pin37 – pin69 pin70 – pin83 pin84 – pin15 — — — — Table 20. Output pin transition times (continued) Symbol C Parameter Conditions1 Value Unit Min Typ Max |
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