BLP27M810 datasheet(4/11 Pages) AMPLEON

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BLP27M810

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Product data sheet

Rev. 1 — 11 February 2016

4 of 11

BLP27M810

Power LDMOS transistor

7. Application information

7.1 Application circuit

Printed-Circuit Board (PCB): Rogers RO4350B;

r = 3.5; thickness = 0.508 mm; thickness copper plating = 35 m.

See Table 8 for list of components.

Fig 1.

Component layout

76.2 mm

40 mm

BLP27M810

2400-2500MHz

20RO4350B [V1]

C10

C11 C12

C13

amp00015

Table 8.

List of components

See Figure 1 for component layout.

Component

Description

Value

Remarks

multilayer ceramic chip capacitor 0.5 pF

ATC 100A

C2, C10

multilayer ceramic chip capacitor 15 pF

ATC 100A

multilayer ceramic chip capacitor 2.2 pF

ATC 100A

C4, C11, C12 multilayer ceramic chip capacitor 1

F, 50 V

Murata: GRM32RR71H105KA01L

C5, C6

multilayer ceramic chip capacitor 2.4 pF

ATC 100A

C7, C8

multilayer ceramic chip capacitor 1.5 pF

ATC 100A

multilayer ceramic chip capacitor 15 pF

ATC 100A

C13

electrolytic capacitor

F, 63 V

chip resistor

5.1



SMD 0805

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