PIC18F1230-ESLASHMLQTP datasheet(17/312 Pages) MICROCHIP

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PIC18F1230/1330

Advance Information

DS39758B-page 15

2.0

OSCILLATOR

CONFIGURATIONS

2.1

Oscillator Types

PIC18F1230/1330 devices can be operated in ten

different oscillator modes. The user can program the

Configuration bits, FOSC3:FOSC0, in Configuration

Low-Power Crystal

Crystal/Resonator

High-Speed Crystal/Resonator

HSPLL High-Speed Crystal/Resonator

with PLL enabled

External Resistor/Capacitor with

FOSC/4 output on RA6

RCIO

External Resistor/Capacitor with I/O

on RA6

INTIO1 Internal Oscillator with FOSC/4 output

on RA6 and I/O on RA7

INTIO2 Internal Oscillator with I/O on RA6

and RA7

External Clock with FOSC/4 output

10. ECIO

External Clock with I/O on RA6

2.2

Crystal Oscillator/Ceramic

Resonators

In XT, LP, HS or HSPLL Oscillator modes, a crystal or

ceramic resonator is connected to the OSC1 and

OSC2 pins to establish oscillation. Figure 2-1 shows

the pin connections.

The oscillator design requires the use of a parallel cut

crystal.

FIGURE 2-1:

CRYSTAL/CERAMIC

RESONATOR OPERATION

(XT, LP, HS OR HSPLL

CONFIGURATION)

TABLE 2-1:

CAPACITOR SELECTION FOR

CERAMIC RESONATORS

Note:

Use of a series cut crystal may give a fre-

quency out of the crystal manufacturer’s

specifications.

Typical Capacitor Values Used:

Mode

Freq

OSC1

OSC2

3.58 MHz

4.19 MHz

4 MHz

15 pF

30 pF

50 pF

15 pF

30 pF

50 pF

Capacitor values are for design guidance only.

Different capacitor values may be required to produce

acceptable oscillator operation. The user should test

the performance of the oscillator over the expected

VDD and temperature range for the application.

See the notes following Table 2-2 for additional

information.

Note 1:

See Table 2-1 and Table 2-2 for initial values of

C1 and C2.

A series resistor (RS) may be required for AT

strip cut crystals.

RF varies with the oscillator mode chosen.

C1(1)

C2(1)

XTAL

OSC2

OSC1

(3)

Sleep

Logic

PIC18FXXXX

RS(2)

Internal

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