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ATLS3A212D Datasheet(PDF) 9 Page - Analog Technologies, Inc.

Part # ATLS3A212D
Description  High Voltage Constant Current 3A Laser Driver
PDF  15 Pages
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Manufacturer  ANALOGTECHNOLOGIES [Analog Technologies, Inc.]
Direct Link  https://www.analogtechnologies.com/
Logo ANALOGTECHNOLOGIES - Analog Technologies, Inc.

ATLS3A212D Datasheet(HTML) 9 Page - Analog Technologies, Inc.

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1161 Ringwood Ct, #110, San Jose, CA 95131, U. S. A. Tel.: (408) 748-9100, Fax: (408) 770-9187
www.analogtechnologies.com
Copyrights 2000-2022, Analog Technologies, Inc. All Rights Reserved. Updated on 7/4/2022
Email: staff@analogti.com/sales@analogti.com
9
Analog Technologies
ATLS3A212
High Voltage Constant Current 3A Laser Driver
Adjusting the Output Current
In typical standalone configuration the output current is set
by adjusting W1 and W2, which set input voltages of LISL
and LISH, pin 6 and 7 respectively. See Figure 7. The
output current will be:
IOUT = 1.2
×VLISL or 1.2×VLISH (A).
LISL and LISH can also be set using DAC as in Figure 8.
Make sure that DAC has low output noise.
Monitoring the Output Current
The output current of the driver can be monitored by
measuring the voltage on the LIO pin. This feature is very
useful for micro-controller based system where the ADC is
available and monitoring the current in real time is required.
This pin provides a very low noise voltage signal and is
proportional to the output current:
IOUT = 1.2
×VLIO (A).
For example, when the output current is 3A, the output signal
is 2.5V.
LIO can be used to drive an ADC directly, and also be
measured by a multi-meter.
Driver Power Consumption
The best way for arranging the heat sinking for the driver is as
follows: transferring the heat by sandwiching a piece of
thermal conductive pad between the top metal surface of the
laser driver and the internal metal surface of the final product
as shown in Figure 9.1 and 9.2 below. The recommended
thickness of the thermal conductive pad in Figure 9.1 is
1~4mm, and in Figure 9.2 is 0.5mm. ATI also provides a series
of thermal conductive pads, click here for more information.
Figure 9.1 Transferring Heat with Metal Enclosure
Figure 9.2 Transferring Heat with Heat Sink



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