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L6711 Datasheet(PDF) 6 Page - STMicroelectronics

Part # L6711
Description  3 PHASE CONTROLLER WITH DYNAMIC VID AND SELECTABLE DACs
PDF  38 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L6711 Datasheet(HTML) 6 Page - STMicroelectronics

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38
VCCDR3
Channel 3 LS driver supply: it can be varied from 5V to 12V buses.
It must be connected together with other VCCDRx pins.
Filter locally with at least 1
µF ceramic cap vs. PGND3.
39
PGND2
Channel 2 LS driver return path.
Connect to Power Ground Plane.
40
LGATE2
Channel 2 LS driver output.
A little series resistor helps in reducing device-dissipated power.
41
VCCDR2
Channel 2 LS driver supply: it can be varied from 5V to 12V buses.
It must be connected together with other VCCDRx pins.
Filter locally with at least 1
µF ceramic cap vs. PGND2.
42
PHASE2 Channel 2 HS driver return path. It must be connected to the HS2 mosfet source and provides
the return path for the HS driver of channel 2.
43
UGATE2 Channel 2 HS driver output.
A little series resistor helps in reducing device-dissipated power.
44
BOOT2
Channel 2 HS driver supply. This pin supplies the relative high side driver.
Connect through a capacitor (100nF Typ.) to the PHASE2 pin and through a diode to VCC (cath-
ode vs. boot).
45
BOOT1
Channel 1 HS driver supply. This pin supplies the relative high side driver.
Connect through a capacitor (100nF Typ.) to the PHASE1 pin and through a diode to VCC (cath-
ode vs. boot).
46
UGATE1 Channel 1 HS driver output.
A little series resistor helps in reducing device-dissipated power.
47
PHASE1 Channel 1 HS driver return path. It must be connected to the HS1 mosfet source and provides
the return path for the HS driver of channel 1.
48
N.C.
Not internally connected.
PAD
THERM
AL PAD
Thermal pad connects the silicon substrate and makes a good thermal contact with the PCB to
dissipate the power necessary to drive the external mosfets. Connect to the GND plane with sev-
eral vias to improve thermal conductivity.
Electrical Characteristcs
(VCC=12V±15%, TJ = 0°C to 70°C unless otherwise specified)
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
VCC SUPPLY CURRENT
ICC
VCC supply current
HGATEx and LGATEx open
VCCDRx=VBOOTx=12V
18
23
mA
ICCDRx
VCCDRx supply current
LGATEx open; VCCDRx=12V
1.5
2
mA
IBOOTx
BOOTx supply current
HGATEx open;PHASEx to
PGNDx
VCC=BOOTx=12V
11.5
mA
POWER-ON
Turn-On VCC threshold
VCC Rising; VCCDRx=5V
8.2
9.2
10.2
V
Turn-Off VCC threshold
VCC Falling; VCCDRx=5V
6.5
7.5
8.5
V
Turn-On VCCDRx
Threshold
VCCDRx Rising
VCC=12V
4.2
4.4
4.6
V
Table 4. Pin Function (continued)
Name
Description



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