| Electronic Components Datasheet Search |
|
L6711 Datasheet(PDF) 6 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
L6711 Datasheet(HTML) 6 Page - STMicroelectronics |
|
6 / 38 page ![]() L6711 6/38 38 VCCDR3 Channel 3 LS driver supply: it can be varied from 5V to 12V buses. It must be connected together with other VCCDRx pins. Filter locally with at least 1 µF ceramic cap vs. PGND3. 39 PGND2 Channel 2 LS driver return path. Connect to Power Ground Plane. 40 LGATE2 Channel 2 LS driver output. A little series resistor helps in reducing device-dissipated power. 41 VCCDR2 Channel 2 LS driver supply: it can be varied from 5V to 12V buses. It must be connected together with other VCCDRx pins. Filter locally with at least 1 µF ceramic cap vs. PGND2. 42 PHASE2 Channel 2 HS driver return path. It must be connected to the HS2 mosfet source and provides the return path for the HS driver of channel 2. 43 UGATE2 Channel 2 HS driver output. A little series resistor helps in reducing device-dissipated power. 44 BOOT2 Channel 2 HS driver supply. This pin supplies the relative high side driver. Connect through a capacitor (100nF Typ.) to the PHASE2 pin and through a diode to VCC (cath- ode vs. boot). 45 BOOT1 Channel 1 HS driver supply. This pin supplies the relative high side driver. Connect through a capacitor (100nF Typ.) to the PHASE1 pin and through a diode to VCC (cath- ode vs. boot). 46 UGATE1 Channel 1 HS driver output. A little series resistor helps in reducing device-dissipated power. 47 PHASE1 Channel 1 HS driver return path. It must be connected to the HS1 mosfet source and provides the return path for the HS driver of channel 1. 48 N.C. Not internally connected. PAD THERM AL PAD Thermal pad connects the silicon substrate and makes a good thermal contact with the PCB to dissipate the power necessary to drive the external mosfets. Connect to the GND plane with sev- eral vias to improve thermal conductivity. Electrical Characteristcs (VCC=12V±15%, TJ = 0°C to 70°C unless otherwise specified) Symbol Parameter Test Condition Min. Typ. Max. Unit VCC SUPPLY CURRENT ICC VCC supply current HGATEx and LGATEx open VCCDRx=VBOOTx=12V 18 23 mA ICCDRx VCCDRx supply current LGATEx open; VCCDRx=12V 1.5 2 mA IBOOTx BOOTx supply current HGATEx open;PHASEx to PGNDx VCC=BOOTx=12V 11.5 mA POWER-ON Turn-On VCC threshold VCC Rising; VCCDRx=5V 8.2 9.2 10.2 V Turn-Off VCC threshold VCC Falling; VCCDRx=5V 6.5 7.5 8.5 V Turn-On VCCDRx Threshold VCCDRx Rising VCC=12V 4.2 4.4 4.6 V Table 4. Pin Function (continued) N° Name Description |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |