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STM32F103XC Datasheet(PDF) 120 Page - STMicroelectronics |
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STM32F103XC Datasheet(HTML) 120 Page - STMicroelectronics |
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120 / 143 page ![]() Package information STM32F103xC, STM32F103xD, STM32F103xE 120/143 DS5792 Rev 13 6.3 WLCSP64 package information Figure 68. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale package outline 1. Drawing is not to scale. 2. Primary datum Z and seating plane are defined by the spherical crowns of the ball. Table 69. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.535 0.585 0.635 0.0211 0.0230 0.0250 A1 0.205 0.230 0.255 0.0081 0.0091 0.0100 A2 0.330 0.355 0.380 0.0130 0.0140 0.0150 |
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