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STM32F103XC Datasheet(PDF) 142 Page - STMicroelectronics

Part # STM32F103XC
Description  High-density performance line Arm®-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
PDF  143 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F103XC Datasheet(HTML) 142 Page - STMicroelectronics

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Revision history
STM32F103xC, STM32F103xD, STM32F103xE
142/143
DS5792 Rev 13
31-08-2015
11
Replaced USBDP and USBDM by USB_DP and USB_DM in the whole
document.
Updated:
– Introduction
– Reference standard in Table 43: ESD absolute maximum ratings.
– Updated IDDA description in Table 63: DAC characteristics.
– Section : I2C interface characteristics
– Figure 62: LFBGA144 – 144-ball low profile fine pitch ball grid array,
10 x 10 mm, 0.8 mm pitch, package outline
– Updated sentence before Figure 78: LQFP64 marking example
(package top view).
– Figure 65: LFBGA100 - 10 x 10 mm low profile fine pitch ball grid
array package outline and sentence before Figure 75: LQFP100
marking example (package top view)
– Figure 68: WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch,
wafer-level chip-scale package outline
– Figure 48: I2C bus AC waveforms and measurement circuit on
page 97
– Section 6.1: LFBGA144 package information and Section 6.2:
LFBGA100 package information.
– Table 20: Peripheral current consumption
Added:
– Figure 63: LFBGA144 – 144-ball low profile fine pitch ball grid array,
10 x 10 mm, 0.8 mm pitch, package recommended footprint
– Figure 64: LFBGA144 marking example (package top view)
– Figure 66: LFBGA100 – 100-ball low profile fine pitch ball grid array,
10 x 10 mm, 0.8 mm pitch, package recommended footprintoutline
– Figure 69: WLCSP64 - 64-ball, 4.4757 x 4.4049 mm, 0.5 mm pitch
wafer level chip scale package recommended footprint
– Table 66: LFBGA144 recommended PCB design rules (0.8 mm pitch
BGA)
– Table 68: LFBGA100 recommended PCB design rules (0.8 mm pitch
BGA)
– Table 70: WLCSP64 recommended PCB design rules (0.5 mm pitch).
26-Nov-2015
12
Updated:
– Table 59: ADC characteristics
– Table 65: LFBGA144 – 144-ball low profile fine pitch ball grid array,
10 x 10 mm, 0.8 mm pitch, package mechanical data
– Table 66: LFBGA144 recommended PCB design rules (0.8 mm pitch
BGA)
Added:
– Note 3 on Table 7: Voltage characteristics
10-Jul-2018
13
Updated:
– Table 2: STM32F103xC, STM32F103xD and STM32F103xE features
and peripheral counts
– Section 7: Ordering information
Table 76.Document revision history
Date
Revision
Changes



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