5

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®

packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions

and product status are available at: www.st.com. ECOPACK® is an ST trademark.

5.1

ACEPACK™ 2 CIB solder pins package information

Figure 23. ACEPACK™ 2 CIB solder pins package outline (dimensions are in mm)

56.7±0.3

51±0.15

22.7±0.3

16.4±0.2

4.5±0.1

3.2 BSC

1.3±0.2

2.5±0.2

52.7 REF

Detail A

3.5 REF x45°

8.5

0.00

9.60

12.80

16.00

19.20

22.40

25.60

28.80

32.00

L3

P1

B

GB

G6

EW

L3

L2

L2

L1

L1

G1

3

G

V

V

G5

T2

T1

EW

G4

EV EV

G2

EU EU

NB

P1

□0.64±0.03

8569722_ACEPACK2_CIB_solderable_pins

W W

U

U

P

P

N

N

•

The lead size includes the thickness of the lead plating material.

•

Dimensions do not include mold protrusion.

•

Package dimensions do not include any eventual metal burrs.

A2C50S65M2

Package information

DS12340 - Rev 3

page 13/16