8 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification,

and TI does not warrant its accuracy or completeness. TI’s customers are responsible for

determining suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

8.1 Application Information

The family of devices are optimized for low noise and low output voltage ripple.

8.2 Typical Applications

Vo

1.2 V / 3 A

Vin

12 V

VIN

EN/SYNC

S-CONF

CIN

2 x 10 µF

COUT

3x

22 µF

FB

PG

NR/SS

OUT

R2

4.87 k

R1

2.43 k

Cf

2 x 22µF

PGND

Lf

10 nH

Figure 8-1. Typical Schematic

Table 8-1 shows the list of components for the application curves in Section 8.2.3, unless otherwise noted.

Table 8-1. List of Components

REFERENCE

PART NUMBER

DESCRIPTION

MANUFACTURER(1)

TPSM82913

TPSM82913

Low-noise and low-ripple buck

module

Texas Instruments

CIN

C2012X7S1E106K125AC

Ceramic capacitors: 2 × 10 µF ±10%

25-V ceramic capacitor X7S 0805

TDK

COUT

C2012X7S1A226M125AC

Ceramic capacitors: 3 × 22 µF, 10 V,

±20%, X7S, 0805

TDK

Lf

BLE18PS080SN1

Ferrite Bead

MuRata

Cf

C2012X7S1A226M125AC

Ceramic capacitor: 2 × 22 µF, 10 V,

±20%, X7S, 0805

TDK

CNR/SS, CFF

Optional, not shown

Ceramic capacitor

Standard

R1, R2

Resistor

Standard

(1)

See the Third-Party Products Disclaimer

8.2.1 Design Requirements

The external components have to fulfill the needs of the application, but also meet the stability criteria of the

control loop of the device. The device is optimized to work within a range of external components, and can be

optimized for the following:

• Efficiency

TPSM82913

SLVSGJ4A – OCTOBER 2022 – REVISED DECEMBER 2022

www.ti.com

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