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IN100-Q1-R-RC1F Datasheet(PDF) 25 Page - List of Unclassifed Manufacturers

Part # IN100-Q1-R-RC1F
Description  Ultra-Low Power Bluetooth Beacon SoC
PDF  49 Pages
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Manufacturer  ETC [List of Unclassifed Manufacturers]
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IN100-Q1-R-RC1F Datasheet(HTML) 25 Page - List of Unclassifed Manufacturers

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N1EDOC-DS-IN100-EN-V1.3
4.4.2. On-chip temperature monitoring
Measured at: Ta = 25°C, VCC= 3.0V, unless otherwise noted (If the on-chip temperature monitor is
used, VCC should not be greater than 3.0V)
Table 7 : Temperature Monitoring Characteristics
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Resolution
Using on-chip V0P8 as
reference
-0.4
°C/LSB
Range
-40
85
°C
Accuracy
With VREF calibration
-10
1.5
10
°C
4.4.3. MGPIO analog measurement
Measured at: Ta = 25°C, VREF=0.8V, VCC=3.0V, unless otherwise noted (If MGPIO analog
measurement is used, VCC should not be greater than 3.0V).
Table 8 : MGPIO Analog monitoring characteristics
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Resolution
Using on-chip V0P8 as
reference
0.74
mV/ LSB
Range
Input range to the MGPIO
PIN is 0V – 1.6V (FS).
0
1.6
V
Accuracy
With VREF calibration only
-3.3
1.1
3.3
%
With ADC offset and VREF
calibration
-0.9
0.3
0.9
%
The device supports ADC value linear scaling to convert from raw voltage to the meaningful user
defined unit. For example, the device can convert a temperature sensor raw voltage output
captured by its ADC to a Celsius temperature unit.
4.5. Load switch - power supply control
The device also provides two load switch pins. Switch 0 (SW0) provides a low impedance path to
VCC when turned on, while Switch 1 (SW1) provides a low impedance path to ground when turned
on as shown in Figure 10.



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