MIC33M650YMP datasheet(13/32 Pages) MICROCHIP

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DS20006253A-page 13

MIC33M650

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

Pin Number

Symbol

Description

2, 3, 4, 5, 23, 24, 39, 40

PGND

Power Ground. PGND is the ground path for the MIC33M650

power module.

1, 53

AUX_PVIN

Auxiliary Power Input Voltage Pin. Connect externally to PVIN.

6, 7, 8, 9, 10, 11, 12,

13, 14, 15, 16, 17, 18,

19, 20, 21, 22

Switch Node Pin. SW connects to the internal MOSFETs and

inductor. Do not connect any external load to this point.

41, 42

PVIN

Power Supply Voltage Pin.

25, 26, 27, 28, 29, 30,

31, 32, 33, 34, 35, 36,

37, 38

OUT

Output Side Connection Pin.

43, 44

SVIN

Analog Voltage Input Pin. SVIN is the power to the internal

reference and control sections of the MIC33M650. Internally

connected to PVIN through a 10W resistor.

46, 47

AUX_AGND

Auxiliary Analog Ground Pin. Connect externally to AGND.

VSEL2

Output Voltage Selection Control 2 (Input) Pin. The logic state of

VSEL1 and VSEL2 selects the output voltage. This input has three

digital states: High, Low and Floating.

VSEL1

Output Voltage Selection Control 1 (Input) Pin. The logic state of

VSEL1 and VSEL2 selects the output voltage. This input has three

digital states: High, Low and Floating.

Enable (Input) Pin. Logic high enables the operation of the

regulator. The EN pin should not be left floating.

Power Good (Output) Pin. This is an open-drain output that

indicates when the output voltage is higher than the 91% limit.

VOUT

Output Voltage Sense (Input) Pin. This pin is used to remote

sense the output voltage. Connect VOUT as close to the output

capacitor as possible to sense the output voltage.

AGND

Analog Ground Pin. AGND is the internal signal ground for all

low-power circuits.

EP_OUT

Exposed Thermal Pad. Internally connected to OUT.

EP_SW

Exposed Thermal Pad. Internally connected to SW.

EP_PGND

Exposed Thermal Pad. Internally connected to PGND.

EP_PVIN

Exposed Thermal Pad. Internally connected to PVIN.

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