ATMEGA6450SLASHV datasheet(3/347 Pages) ATMEL

3 / 347 page

ATmega325/3250/645/6450

2570A–AVR–09/04

Figure 2. Pinout ATmega325/645

Note:

The large center pad underneath the MLF packages is made of metal and internally con-

nected to GND. It should be soldered or glued to the board to ensure good mechanical

stability. If the center pad is left unconnected, the package might loosen from the board.

Disclaimer

Typical values contained in this datasheet are based on simulations and characteriza-

tion of other AVR microcontrollers manufactured on the same process technology. Min

and Max values will be available after the device is characterized.

PC0

(RXD/PCINT0) PE0

(TXD/PCINT1) PE1

(XCK/AIN0/PCINT2) PE2

(AIN1/PCINT3) PE3

(USCK/SCL/PCINT4) PE4

(DI/SDA/PCINT5) PE5

(DO/PCINT6) PE6

(CLKO/PCINT7) PE7

(SCK/PCINT9) PB1

(MOSI/PCINT10) PB2

(MISO/PCINT11) PB3

(OC0A/PCINT12) PB4

(OC1B/PCINT14) PB6

(OC1A/PCINT13) PB5

PC1

PG0

PC2

PC3

PC4

PC5

PC6

PC7

PA7

PG2

PA6

PA5

PA4

PA3

PG1

INDEX CORNER

(SS/PCINT8) PB0

ATmega325/645

DNC

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