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UPD301A/KYX Datasheet(PDF) 26 Page - Microchip Technology |
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UPD301A/KYX Datasheet(HTML) 26 Page - Microchip Technology |
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26 / 40 page ![]() UPD301A DS00002838B-page 26 2018-2019 Microchip Technology Inc. 5.3 Package Thermal Specifications FIGURE 5-1: SUPPLY RISE TIME MODEL TABLE 5-1: PACKAGE THERMAL PARAMETERS Parameter Symbol °C/W Thermal Resistance Junction to Ambient (@ 0 air flow) JA 36.6 Thermal Resistance Junction to Top of Case JC 9.2 Thermal Resistance Junction to Board JB 15.7 Thermal Resistance Junction to Bottom of Case (@ 0 air flow) JT 0.2 Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51. TABLE 5-2: POWER DISSIPATION Parameter Symbol Max Units Power Dissipation Pdis 214 mW Note: This is the worst-case power dissipation as a consequence of maximum loading (before current-limiting protections take effect) upon the VCONN power switch, 3.3V power-ORing switch, analog blocks, and core digital logic. t10% 10% 90% Voltage tRT t90% Time 100% 3.3V VSS VDD33_IO_IN |
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