6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input voltage (2)

VIN

–0.3

18

V

Input voltage (2)

FB, EN

–0.3

6

V

Input voltage (2)

GND

–0.3

0.3

V

Output voltage (2)

BST

–0.3

25

V

Output voltage (2)

BST (< 20 ns)

–0.3

27

V

Output voltage (2)

SW

–2

18

V

Output voltage (2)

SW (< 20 ns)

–6.5

20

V

Operating Junction Temperature

Range, TJ

–40

150

°C

Storage temperature, Tstg

Storage temperature, Tstg

–55

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC

JS-002(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage (2)

VIN

4.2

17

V

Input voltage (2)

FB, EN

–0.1

5.5

V

Input voltage (2)

GND

–0.1

0.1

V

Output voltage (2)

BST

–0.1

23

V

Output voltage (2)

BST (< 20ns)

–0.1

25

V

Output voltage (2)

SW

–1

17

V

Output voltage (2)

SW (< 20ns)

–6

19

V

Output current

IO

0

3

A

TJ

Operating junction temperature

–40

125

°C

Tstg

Storage temperature

–40

150

°C

6.4 Thermal Information

THERMAL METRIC(1)

DRL (SOT-563)

UNIT

6 PINS

RθJA

Junction-to-ambient thermal resistance

147.4

°C/W

RθJA_effective

Junction-to-ambient thermal resistance on EVM board

73(2)

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

75.7

°C/W

TPS563203, TPS563206

SLUSEZ4 – MARCH 2023

www.ti.com

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