MF0AES2001DUD datasheet(8/72 Pages) NXP

8 / 72 page

NXP Semiconductors

MF0AES(H)20

MIFARE Ultralight AES contactless limited-use IC

5 Ordering information

Type number

Package Description

Memory Input

cap

UID

MF0AES2001DUD

FFC

8 inch wafer (laser diced, 120 µm) [1]

144 byte 17 pF 7 byte

MF0AES2001DUF

FFC

8 inch wafer (laser diced, 75 µm) [1]

144 byte 17 pF 7 byte

MF0AES2000DA8

MOA8

Plastic leadless module carrier package [2]

144 byte 17 pF 7 byte

MF0AESH2001DUD

FFC

8 inch wafer (laser diced, 120 µm) [1]

144 byte 50 pF 7 byte

MF0AESH2001DUF

FFC

8 inch wafer (laser diced, 75 µm) [1]

144 byte 50 pF 7 byte

MF0AESH2000DA8

MOA8

Plastic leadless module carrier package [2]

144 byte 50 pF 7 byte

Table 3. Ordering information MF0AES(H)xy

[1]

On FFC (Film Frame Carrier) with electronic fail die marking according to SECSII format

[2]

Plastic leadless module carrier package; 35 mm wide tape

MF0AES_H_20

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3.2 — 28 March 2023

8 / 72

MF0AES2001DUD Datasheet(PDF) 8 Page - NXP Semiconductors

MF0AES2001DUD Datasheet(HTML) 8 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72

Datasheet Download

Link URL