SCM69C433 datasheet(21/24 Pages) MOTOROLA

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MCM69C433

•SCM69C433

MOTOROLA FAST SRAM

TQ PACKAGE

TQFP

CASE 983A–01

PACKAGE DIMENSIONS

DIM

MIN

MAX

MILLIMETERS

–––

1.60

0.05

0.15

1.35

1.45

0.22

0.38

0.22

0.33

0.09

0.20

0.09

0.16

22.00 BSC

16.00 BSC

14.00 BSC

0.65 BSC

0.45

0.75

1.00 REF

0.50 REF

0.20

–––

0.08

–––

0.08

0.20

–––

20.00 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,

1982.

2. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD

AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD

EXITS THE PLASTIC BODY AT THE BOTTOM OF THE

PARTING LINE.

3. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT

DATUM PLANE –H–.

4. DIMENSIONS D AND E TO BE DETERMINED AT SEATING

PLANE –C–.

5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010)

PER SIDE. DIMENSIONS D1 AND B1 DO INCLUDE MOLD

MISMATCH AND ARE DETERMINED AT DATUM PLANE

–H–.

6. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL NOT

CAUSE THE b DIMENSION TO EXCEED 0.45 (0.018).

A–B

0.20 (0.008) H

A–B

0.20 (0.008) C

A–B

0.20 (0.008) C

0.10 (0.004) C

0.25 (0.010)

0.05 (0.002)

A–B

0.13 (0.005)

D S

e/2

D/2

D1/2

E1/2

E/2

2X 30 TIPS

2X 20 TIPS

–D–

–B–

–A–

–C–

–H–

100

PLATING

SECTION B–B

BASE

METAL

SEATING

PLANE

VIEW AB

GAGE PLANE

–X–

VIEW Y

X=A, B, OR D

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

IVE

D B

Y F

INC

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