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ADMV8513ACCZ-R7 Datasheet(PDF) 15 Page - Analog Devices |
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ADMV8513ACCZ-R7 Datasheet(HTML) 15 Page - Analog Devices |
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15 / 31 page ![]() Data Sheet ADMV8513 APPLICATIONS INFORMATION analog.com Rev. 0 | 15 of 31 INTERPOLATION COEFFICIENTS For reference, the ADMV8513 interpolation coefficients that were used for device characterization are listed in Table 11. These inter- polation coefficients are provided as a good starting point for use in a system. Depending upon the system requirements and allowable process tolerance, some minor adjustments may be needed to the interpolation coefficients. For most applications, the device process tolerance within a particular lot of material allows for one set of interpolation coefficients, such that interpolation coefficient calibration only needs to be performed once per lot. Refer to the Interpolation Coefficient Calibration section for more information on how to adjust the interpolation coefficients. Table 11. Interpolation Coefficients Interpolation Coefficients Coefficient Bit Field Narrow Bandwidth Nominal Bandwidth Wide Bandwidth Y0 INTERP_FC_Y0 214 218 224 Y1 INTERP_FC_Y1 172 176 180 Y2 INTERP_FC_Y2 139 142 146 Y3 INTERP_FC_Y3 100 102 104 Y4 INTERP_FC_Y4 73 75 76 Y5 INTERP_FC_Y5 54 55 56 Y6 INTERP_FC_Y6 41 42 43 Y7 INTERP_FC_Y7 31 32 32 Y8 INTERP_FC_Y8 24 24 24 Y9 INTERP_FC_Y9 18 19 19 V0 INTERP_BW_V0 2 1 0 V1 INTERP_BW_V1 13 5 0 V2 INTERP_BW_V2 75 39 0 T0 INTERP_MATCH_T0 4 5 5 T1 INTERP_MATCH_T1 20 25 30 T2 INTERP_MATCH_T2 109 138 175 PRINTED CIRCUIT BOARD (PCB) DESIGN GUIDELINES The PCB used to implement the ADMV8513 can use standard quality dielectric materials between the top metallization layer and internal ground layer, such as the Isola 370HR. Rogers 4003 or the Rogers 4350 do not have to be used. The characteristic impedance of the transmission lines to the RF1 and RF2 pins of the ADMV8513 must be controlled to 50 Ω to ensure optimal RF performance. Connect the GND pins and exposed pads of the ADMV8513 directly to the ground plane of the PCB. Use a sufficient number of via holes to connect the top and bottom ground planes of the PCB. |
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