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STM32L010RB Datasheet(PDF) 44 Page - STMicroelectronics |
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STM32L010RB Datasheet(HTML) 44 Page - STMicroelectronics |
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44 / 89 page ![]() Electrical characteristics STM32L010RB 44/89 DS12319 Rev 3 The MCU is placed under the following conditions: • All I/O pins are configured in analog input mode • All peripherals are disabled except when explicitly mentioned • The Flash memory access time and prefetch is adjusted depending on fHCLK frequency and voltage range to provide the best CPU performance unless otherwise specified. • When the peripherals are enabled fAPB1 = fAPB2 = fAPB • When PLL is ON, the PLL inputs are equal to HSI = 16 MHz (if internal clock is used) or HSE = 16 MHz (if HSE mode is used) • The HSE user clock is applied to CK_IN. It follows the characteristic specified in Table 32: High-speed external user clock characteristics • For maximum current consumption VDD = VDDA = 3.6 V is applied to all supply pins • For typical current consumption VDD = VDDA = 3.0 V is applied to all supply pins if not specified otherwise Table 19. Current consumption in Run mode, code with data processing running from Flash memory Symbol Parameter Conditions fHCLK (MHz) Typ Max Unit IDD (Run from Flash memory) Supply current in Run mode, code executed from Flash memory fHSE = fHCLK up to 16 MHz included, fHSE =fHCLK/2 above 16 MHz (PLL ON)(1) Range 3, VCORE =1.2 V VOS[1:0] = 11 1 190 250 µA 2 345 380 4 650 670 Range 2, VCORE =1.5 V VOS[1:0] = 10, 4 0.8 0.86 mA 8 1.55 1.7 16 2.95 3.1 Range 1, VCORE =1.8 V VOS[1:0] = 01 81.9 2.1 16 3.55 3.8 32 6.65 7.2 MSI clock Range 3, VCORE =1.2 V VOS[1:0] = 11 0.065 39 130 µA 0.524 115 210 4.2 700 770 HSI clock Range 2, VCORE =1.5 V VOS[1:0] = 10, 16 2.9 3.2 mA Range 1, VCORE =1.8 V VOS[1:0] = 01 32 7.2 7.4 1. Oscillator bypassed (HSEBYP = 1 in RCC_CR register). |
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