NXP Semiconductors

P5DF081_SDS

MIFARE secure access module SAM AV2

5 Ordering information

Package

Type number

Name

Description

Version

P5DF081X0/T1AD2060

PCM1.1 [1]

contact chip card module (super 35 mm tape format,

8 contact), minimum order quantity: 10.000

SOT658-1

P5DF081X0/T1AD2060S

PCM1.1 [1]

contact chip card module (super 35 mm tape format,

8 contact), minimum order quantity: 1.000

SOT658-1

P5DF081HN/T1AD2060

HVQFN32

plastic thermal enhanced very thin quad flat package; no leads;

32 terminals; body 5 x 5 x 0.85 mm

SOT617-3

P5DF081UA/T1AD2060

FCC

sawn wafer 150 µm on film frame carrier

-

P5DF081X0/T1AR1070

PCM1.1 [1]

contact chip card module (super 35 mm tape format,

8 contact), minimum order quantity: 10.000

SOT658-1

P5DF081X0/T1AR1070S

PCM1.1 [1]

contact chip card module (super 35 mm tape format,

8 contact), minimum order quantity: 1.000

SOT658-1

P5DF081HN/T1AR1070

HVQFN32

plastic thermal enhanced very thin quad flat package; no leads;

32 terminals; body 5 x 5 x 0.85 mm

SOT617-3

P5DF081UA/T1AR1070

FCC

sawn wafer 150 µm on film frame carrier

-

Table 2. Ordering information

[1]

NXP Semiconductors is ending the internal PCM1.1 manufacturing of 8-pin contact modules. For more information please contact your sales

representative.

P5DF081_SDS

All information provided in this document is subject to legal disclaimers.

© 2023 NXP B.V. All rights reserved.

Product short data sheet

Rev. 3.3 — 13 September 2023

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