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THGAMRG7T13BAIL Datasheet(PDF) 3 Page - Toshiba Semiconductor |
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THGAMRG7T13BAIL Datasheet(HTML) 3 Page - Toshiba Semiconductor |
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3 / 32 page ![]() THGAMRG7T13BAIL 3 February 14th, 2019 © 2019 Toshiba Memory Corporation Sleep Mode Current Part Number Density NAND Flash Type Interleave Operation ICCQS [μA] ICCQS+ICCS [μA] Typ. Note 1 Max. Note 2 Typ. Note 1 Max. Note 2 THGAMRG7T13BAIL 16GB 1 x 128Gbit BiCS3 Non Interleave TBD TBD TBD TBD Note 1: The conditions of typical values are 25°C and VCCQ = 1.8V. Note 2: The conditions of maximum values are 85°C and VCCQ = 1.95V. Product Architecture The diagram in Figure 1 illustrates the main functional blocks of the THGAMRG7T13BAIL. Specification of the CREG and recommended values of the CVCC, and CVCCQ in the Figure 1 are as follows. Parameter Symbol Unit Min. Typ. Max. Remark VDDi capacitor value CREG μF 1 2.2 Note 1 4.7 VCC capacitor value CVCC μF - 4.7 + 0.22 - VCCQ capacitor value CVCCQ μF - 4.7 + 0.1 - Note 1: Toshiba Memory recommends that the value should be usually applied as the value of CREG. Figure 1 THGAMRG7T13BAIL Block Diagram REGULATOR CORE LOGIC NAND NAND Control signal NAND I/O VCC (3.3V) x11 VCCQ (1.8V) VDDi MMC I/F (1.8V) Package CVCC CVCCQ CREG |
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