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THGAMRG7T13BAIL Datasheet(PDF) 3 Page - Toshiba Semiconductor

Part # THGAMRG7T13BAIL
Description  16GB THGAMRG7T13BAIL
PDF  32 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

THGAMRG7T13BAIL Datasheet(HTML) 3 Page - Toshiba Semiconductor

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THGAMRG7T13BAIL
3
February 14th, 2019
© 2019 Toshiba Memory Corporation
Sleep Mode Current
Part Number
Density
NAND Flash Type
Interleave
Operation
ICCQS [μA]
ICCQS+ICCS [μA]
Typ. Note 1
Max. Note 2
Typ. Note 1
Max. Note 2
THGAMRG7T13BAIL
16GB
1 x 128Gbit BiCS3
Non Interleave
TBD
TBD
TBD
TBD
Note 1: The conditions of typical values are 25°C and VCCQ = 1.8V.
Note 2: The conditions of maximum values are 85°C and VCCQ = 1.95V.
Product Architecture
The diagram in Figure 1 illustrates the main functional blocks of the THGAMRG7T13BAIL.
Specification of the CREG and recommended values of the CVCC, and CVCCQ in the Figure 1 are as follows.
Parameter
Symbol
Unit
Min.
Typ.
Max.
Remark
VDDi capacitor value
CREG
μF
1
2.2 Note 1
4.7
VCC capacitor value
CVCC
μF
-
4.7 + 0.22
-
VCCQ capacitor value
CVCCQ
μF
-
4.7 + 0.1
-
Note 1: Toshiba Memory recommends that the value should be usually applied as the value of CREG.
Figure 1
THGAMRG7T13BAIL Block Diagram
REGULATOR
CORE LOGIC
NAND
NAND
Control signal
NAND I/O
VCC (3.3V)
x11
VCCQ (1.8V)
VDDi
MMC I/F (1.8V)
Package
CVCC
CVCCQ
CREG



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