SL2S3003 datasheet(30/82 Pages) NXP

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NXP Semiconductors

SL2S3003/SL2S3003TT

ICODE 3 (TagTamper)

8.2.3.2 TagTamper feature (SL2S3003TT)

The TagTamper feature in SL2S3003TT enables the label IC to detect if the TagTamper wire is open or closed at

the start-up of the IC.

When detecting an open TagTamper wire after the label IC tag is powered by an RF field, the status is actual

TagTamper. If the OTP_TT_EN bit (see Table 33) is set, the event is stored permanently in the IC.

During the tag initialization, the user programs the 4-byte TagTamper message into TT_OPEN_MSG

configuration block 47h. If the TT_LOCK bit is set to 1:

• If the TagTamper open event has not been detected, the TT_OPEN_MSG bytes are masked with 00h at

READ CONFIG command, or

• If the TagTamper open event has been detected and stored earlier, the programmed TT_OPEN_MSG bytes

respond to a READ CONFIG command.

The TagTamper status can be read with:

• READ TT STATUS command, or

• TagTamper ASCII mirror feature.

If the TagTamper wire has never been detected as open at start-up:

• The READ TT command responds with actual and stored TagTamper status closed depending on the

TT_SHOW_STATUS bits.

• If the TagTamper ASCII mirror is enabled, the original programmed user memory content is read at that

position.

Once the TagTamper wire has been detected as open at start-up:

• The IC stores permanently the information about the open TagTamper wire if the OTP_TT_EN is enabled.

• On a READ TT command, the IC responds with the actual and stored TagTamper status as open.

• If the TagTamper ASCII mirror is enabled, the programmed TT_OPEN_MSG is mirrored in ASCII to the

defined position in the user memory (see Section 8.2.3.3).

Parameters for the detection of open or closed TagTamper wire connected to DP and GND pad are specified in

Section 10.2.

Note: To avoid interferences induced by the RF field during the measurement of the TagTamper, keep the area

covered by the TagTamper wire connected to DP and GND as small as possible. The area must not be larger

than 2.5 cm2 depending on the RF field strength used in the application under the worst case conditions.

SL2S3003/SL2S3003TT

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3.0 — 28 March 2024

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SL2S3003 Datasheet(PDF) 30 Page - NXP Semiconductors